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MP Govt Signs Deal with Submer to Build Eco-Friendly AI Data Centres

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 The Madhya Pradesh State Electronics Development Corporation (MPSEDC) has signed a Memorandum of Understanding (MoU) with Spain-based Submer Technologies. 

The agreement will pave the way for developing up to 1 gigawatt of next-generation, AI-ready data centre capacity in Madhya Pradesh, using Submer’s advanced cooling technologies. These technologies, like immersion cooling and direct-to-chip solutions, help save energy, reduce water usage, and lower the overall environmental impact of data centres.

 “Following our visit to Submer’s facility, we are convinced of the potential for transformative collaboration. This partnership reflects our vision for sustainable technology, job creation, and positioning Madhya Pradesh as a preferred destination for global innovation,” Mohan Yadav  CM, MP said.

The deal was finalised after a high-level visit to Submer’s innovation centre in Barcelona on July 17, 2025. 

As part of the agreement, the MP government will support the project by helping with land allocation, approvals, and investment incentives.

On the other hand, Submer will offer expertise in design, training, and technical support to set up the facilities. The company’s solutions have already led to 600 GWh of electricity savings and saved over 3 billion liters of water worldwide.

“This MoU marks the beginning of a robust partnership that will catalyze local employment, skill development, and innovation while building scalable infrastructure for the AI era,” Sanjay Dubey,additional chief secretary of department of science and technology, GoMP  said.

Submer’s leadership team is expected to visit MP later this month to explore potential sites and meet with local partners.



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Tessolve Semiconductor Secures $150 Mn Funding from TPG for its Global Delivery Centres

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Tessolve, a Bengaluru-based semiconductor engineering services firm owned by Hero Electronix, has secured $150 million from the growth division of investment firm TPG for acquisitions. It will enhance its testing laboratories and strengthen its global delivery centres, according to a statement issued by the companies on September 1.

The investment will be used to bolster Tessolve’s global delivery centres, broaden its advanced testing laboratories and expedite strategic acquisitions as it aims to solidify its position within the global semiconductor value chain.

“With the support of over 3,500 engineers, Hero Electronix and Novo Tellus Capital Partners, we are excited to welcome TPG as a partner in shaping the future of semiconductors,” the company said in a statement.
Ujjwal Munjal, who serves as the vice chairman of Hero Electronix and the chairman of Tessolve, described the agreement as a “significant milestone”. He noted that partnering with TPG would facilitate Tessolve’s growth, positioning it as a key contributor to the global semiconductor value chain, the Business Standard reported.

Srini Chinamilli, the CEO and cofounder of Tessolve, said, “Over the past couple of decades, Tessolve has built deep capabilities throughout the semiconductor engineering value chain, from chip architecture to design, test development and embedded systems.”

Tessolve partners with 18 of the world’s top 20 semiconductor firms and employs over 3,000 engineers in India, the US, UK, Germany, Singapore and Malaysia. This deal also highlights private equity’s interest in semiconductor supply chain opportunities beyond manufacturing.

According to Tracxn, Tessolve has secured a total of $213 million across eight funding rounds: one seed round, one early-stage round, five late-stage rounds and one private equity round. 

The semiconductor industry’s growing importance, driven by AI, automotive electrification and cloud demand, has heightened the need for engineering services that aid chip companies in transitioning from design to production.

The post Tessolve Semiconductor Secures $150 Mn Funding from TPG for its Global Delivery Centres appeared first on Analytics India Magazine.



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OpenAI to Establish Data Centre in India to Expand Stargate AI Infra

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Salesforce Uses AI Agents to Cut 4,000 Support Jobs and Drive Leads

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Salesforce, the American CRM platform, has reduced its support staff from 9,000 to about 5,000 after deploying its new agentic service and support product, according to CEO Marc Benioff.

Speaking on a recent podcast, Benioff said Salesforce acted as “customer zero” for the tool, which has already handled about 1.5 million customer conversations. Human support agents conducted roughly the same number of interactions over the same period.

Benioff emphasised that AI is not just reducing costs but also boosting revenue. Salesforce had more than 100 million unaddressed leads built up over the last 26 years due to limited staffing, he revealed, adding that with its new agentic sales system, Salesforce is now contacting every lead, conducting more than 10,000 conversations per week.

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